TRAY FOR SUBSTRATE TRANSPORT AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To solve a problem that temperature distribution easily occurs on a substrate surface and the line width and precision of a circuit pattern fluctuate since durability improves but thermal conductivity between ceramics, and a substrate is deteriorated when a tray for substrate t...

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Bibliographic Details
Main Authors KUROTAKE HIROYUKI, INAMOTO YOSHIMASA, MIYAKE KIYOO
Format Patent
LanguageEnglish
Published 25.10.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To solve a problem that temperature distribution easily occurs on a substrate surface and the line width and precision of a circuit pattern fluctuate since durability improves but thermal conductivity between ceramics, and a substrate is deteriorated when a tray for substrate transport is constituted of the ceramics and the coat of the ceramics is formed on the surface of a metallic tray main body like a conventional case. SOLUTION: A material having insulation property and having flexibility is arranged in the recessed part of the tray main body constituted of a material superior in thermal conductivity. A surface outer than the recessed part of the tray main body is constituted of the material having corrosion resistance or sputtering resistance.
Bibliography:Application Number: JP20010116570