FILM DEPOSITION APPARATUS USING CATHODE ARC DISCHARGE
PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can deposite a thin film having small internal stress as the film deposition apparatus in which thin films can be deposited using cathode arc discharge. SOLUTION: When irradiating a substrate 41 with a plasma beam PB generated from a...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
31.07.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can deposite a thin film having small internal stress as the film deposition apparatus in which thin films can be deposited using cathode arc discharge. SOLUTION: When irradiating a substrate 41 with a plasma beam PB generated from a target by cathode arc discharge to deposit a thin film, the normal to the substrate surface is tilted by an angle α relatively to the beam direction of the plasma beam PB. Consequently, migration at the time of film deposition is promoted, and a film having small internal stress is formed. Moreover, the film uniformity can be improved by rotating the substrate 41 in its plane. |
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Bibliography: | Application Number: JP20010010046 |