MANUFACTURE OF DIAPHRAGM

PROBLEM TO BE SOLVED: To provide a method that can precisely and quickly manufacture a flexible diaphragm irrespective of such a parameter as temperature. SOLUTION: A cavity is etched in one surface of a wafer and the other surface is then ground to a small thickness to manufacture a diaphragm. For...

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Bibliographic Details
Main Authors MITCHELL S J NEIL, GAMBLE HAROLD S, FITZGERALD STEPHEN PETER, PROCHASKA ANDRZEJ
Format Patent
LanguageEnglish
Published 19.03.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PRINTING
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SELECTIVE PRINTING MECHANISMS
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:PROBLEM TO BE SOLVED: To provide a method that can precisely and quickly manufacture a flexible diaphragm irrespective of such a parameter as temperature. SOLUTION: A cavity is etched in one surface of a wafer and the other surface is then ground to a small thickness to manufacture a diaphragm. For repressing diaphragm deformation by grinding wheel pressure in the grinding, porous silicon is formed as a sacrificial layer in the cavity to reinforce the diaphragm. The formed porous silicon is removed after the grinding process.
Bibliography:Application Number: JP20010187791