WIRING SUBSTRATE

• Main Authors: MORI TERUTAKA, SUZUKI KIYOMITSU, HASEBE TAKEHIKO, USHIFUSA NOBUYUKI
• Format: Patent
• Language: English
• Published: 10.07.2001
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To enable high-density wiring by forming a metal core with a material having a low thermal expansion coefficient. SOLUTION: An external layer is formed by laminating a copper-clad insulating sheet, which is formed by forming an insulating layer on a copper foil, to a single sid...