WIRING SUBSTRATE

• Main Authors: MORI TERUTAKA, SUZUKI KIYOMITSU, HASEBE TAKEHIKO, USHIFUSA NOBUYUKI
• Format: Patent
• Language: English
• Published: 10.07.2001
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To enable high-density wiring by forming a metal core with a material having a low thermal expansion coefficient. SOLUTION: An external layer is formed by laminating a copper-clad insulating sheet, which is formed by forming an insulating layer on a copper foil, to a single side or both sides of a metal-core copper-clad laminate, on which circuits have been formed on its single side or both sides. The copper foil in unnecessary regions of the external layer is removed by etching. The insulating layer in specified regions are removed, and via holes are formed, through which electrical continuity is made to form a metal-core multilayer laminate, on which semiconductor components are mounted. The purpose is achieved by using for the metal core a copper material compounded with copper oxide which is a material having a low thermal expansion coefficient or a clad material which is formed by laminating the copper material compounded with copper oxide to adhere to an iron-nickel alloy.