MANUFACTURE FOR ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a printed board is incorporat housing. SOLUTION: An electronic apparatus 2 is composed of a printed board 10 having circuit elements 12 and a connect...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
20.10.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a printed board is incorporat housing. SOLUTION: An electronic apparatus 2 is composed of a printed board 10 having circuit elements 12 and a connector 14 mounted, a protecting case 20 for storing the printed board and, a protecting cover 30. In building the printed board 10 into a housing of the protecting case 20 and the protecting cover 30, first, the printed board is accommodated in the protecting case 20 with a mount face for circuit elements 12 of the printed board 10 set inside. A characteristic of each circuit element 12 is inspected and an operation of the whole printed board 10 is checked in this state. When an abnormality is not detected in each inspection, the protecting cover 30 is dpped over the protecting case 20 and fixed. As a result, the failure of the circuit elements 12 can be detected in a stage where the the printed board 10 is accommodated in the protecting case 20, and the point of the failure can be quickly specified. |
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AbstractList | PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a printed board is incorporat housing. SOLUTION: An electronic apparatus 2 is composed of a printed board 10 having circuit elements 12 and a connector 14 mounted, a protecting case 20 for storing the printed board and, a protecting cover 30. In building the printed board 10 into a housing of the protecting case 20 and the protecting cover 30, first, the printed board is accommodated in the protecting case 20 with a mount face for circuit elements 12 of the printed board 10 set inside. A characteristic of each circuit element 12 is inspected and an operation of the whole printed board 10 is checked in this state. When an abnormality is not detected in each inspection, the protecting cover 30 is dpped over the protecting case 20 and fixed. As a result, the failure of the circuit elements 12 can be detected in a stage where the the printed board 10 is accommodated in the protecting case 20, and the point of the failure can be quickly specified. |
Author | OHASHI HIDEYUKI KITAGAWA YOSHIHIRO |
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Snippet | PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a... |
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SubjectTerms | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
Title | MANUFACTURE FOR ELECTRONIC APPARATUS |
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