MANUFACTURE FOR ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a printed board is incorporat housing. SOLUTION: An electronic apparatus 2 is composed of a printed board 10 having circuit elements 12 and a connect...

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Main Authors KITAGAWA YOSHIHIRO, OHASHI HIDEYUKI
Format Patent
LanguageEnglish
Published 20.10.2000
Edition7
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Abstract PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a printed board is incorporat housing. SOLUTION: An electronic apparatus 2 is composed of a printed board 10 having circuit elements 12 and a connector 14 mounted, a protecting case 20 for storing the printed board and, a protecting cover 30. In building the printed board 10 into a housing of the protecting case 20 and the protecting cover 30, first, the printed board is accommodated in the protecting case 20 with a mount face for circuit elements 12 of the printed board 10 set inside. A characteristic of each circuit element 12 is inspected and an operation of the whole printed board 10 is checked in this state. When an abnormality is not detected in each inspection, the protecting cover 30 is dpped over the protecting case 20 and fixed. As a result, the failure of the circuit elements 12 can be detected in a stage where the the printed board 10 is accommodated in the protecting case 20, and the point of the failure can be quickly specified.
AbstractList PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a printed board is incorporat housing. SOLUTION: An electronic apparatus 2 is composed of a printed board 10 having circuit elements 12 and a connector 14 mounted, a protecting case 20 for storing the printed board and, a protecting cover 30. In building the printed board 10 into a housing of the protecting case 20 and the protecting cover 30, first, the printed board is accommodated in the protecting case 20 with a mount face for circuit elements 12 of the printed board 10 set inside. A characteristic of each circuit element 12 is inspected and an operation of the whole printed board 10 is checked in this state. When an abnormality is not detected in each inspection, the protecting cover 30 is dpped over the protecting case 20 and fixed. As a result, the failure of the circuit elements 12 can be detected in a stage where the the printed board 10 is accommodated in the protecting case 20, and the point of the failure can be quickly specified.
Author OHASHI HIDEYUKI
KITAGAWA YOSHIHIRO
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Snippet PROBLEM TO BE SOLVED: To improve manufacturing efficiency for electronic apparatuses by speedily detecting failures of circuit elements generated when a...
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SubjectTerms MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Title MANUFACTURE FOR ELECTRONIC APPARATUS
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