METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENTS

• Main Author: TAKAMURA KEIJI
• Format: Patent
• Language: English
• Published: 29.09.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent generation of residual voids between an electronic component and a carrier tape by conducting a process of heating and bonding the electronic component to an adhesive layer formed on the carrier tape, in the vacuum. SOLUTION: Electrode pads 1a made of metal or other material are formed on the bottom face of a semiconductor device 1. Meanwhile, an adhesive layer 24 made of a thermoplastic polyimide adhesive, etc., is formed on the upper face of an insulation film 25 of a carrier tape 2. At a specified place of the insulation film 25, an interconnection layer 26 having a specified wiring pattern is formed. Bump electrodes 27 made of solder balls, etc., are electrically connected to the interconnection layer 26. In the vacuum, wherein the air between the semiconductor device 1 and the adhesive layer 24 of the carrier tape 2 is almost completely eliminated, the semiconductor device 1 is heated so as to be bonded to the adhesive layer 24 of the carrier tape 2.