SILICONE SOLIDIFIED MATERIAL

PROBLEM TO BE SOLVED: To provide a silicone solidified material easily by applying a simple handling of a non-adherent treatment to a surface, even in a radiating member with high heat conductive and high soft properties such as a radiating spacer and the like. SOLUTION: A silicone solidified materi...

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Bibliographic Details
Main Authors IKEDA KAZUYOSHI, SAWA HIROAKI
Format Patent
LanguageEnglish
Published 02.08.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Abstract PROBLEM TO BE SOLVED: To provide a silicone solidified material easily by applying a simple handling of a non-adherent treatment to a surface, even in a radiating member with high heat conductive and high soft properties such as a radiating spacer and the like. SOLUTION: A silicone solidified material is characterized by applying a non-adherent treatment using an ultraviolet containing wavelength not more than 180 nm, particularly the UV generated by excimer lamp, particularly the silicone solidified material being a mixture solidified material of a liquid addition-reactive silicone of 30-80 vol.% with a heat conductive filler of 20-70 vol.%, its Ascar C hardness being not more than 60 and heat conductivity being 0.5 W/mK.
AbstractList PROBLEM TO BE SOLVED: To provide a silicone solidified material easily by applying a simple handling of a non-adherent treatment to a surface, even in a radiating member with high heat conductive and high soft properties such as a radiating spacer and the like. SOLUTION: A silicone solidified material is characterized by applying a non-adherent treatment using an ultraviolet containing wavelength not more than 180 nm, particularly the UV generated by excimer lamp, particularly the silicone solidified material being a mixture solidified material of a liquid addition-reactive silicone of 30-80 vol.% with a heat conductive filler of 20-70 vol.%, its Ascar C hardness being not more than 60 and heat conductivity being 0.5 W/mK.
Author IKEDA KAZUYOSHI
SAWA HIROAKI
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Snippet PROBLEM TO BE SOLVED: To provide a silicone solidified material easily by applying a simple handling of a non-adherent treatment to a surface, even in a...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
Title SILICONE SOLIDIFIED MATERIAL
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