LAMINATED POLYAMIDE RESIN FILM
PROBLEM TO BE SOLVED: To provide a laminated polyamide resin film improved in slip properties under a high humidity condition while holding transparency. SOLUTION: An adhesion modifying layer constituted of a self-crosslinkable polyester graft copolymer obtained by the graft copolymerization of a po...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
25.01.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a laminated polyamide resin film improved in slip properties under a high humidity condition while holding transparency. SOLUTION: An adhesion modifying layer constituted of a self-crosslinkable polyester graft copolymer obtained by the graft copolymerization of a polymerizable unsaturated monomer containing a hydrophilic polymerizable unsaturated monomer with a hydrophobic polyester resin is formed on at least one surface of a polyamide resin film formed from a compsn. prepared by adding 0.05-1.0 pts.wt. of inorg. or org. fine particles with an average particle size of 0.5-5.0 μm to 100 pts.wt. of a polyamide resin compsn. based on an aromatic polyamide resin component (X) comprising terephthalic acid and/or isophthalic acid and a 6-12C aliphatic diamine and an aliphatic polyamide resin component (Y) and containing 0.2-10.0 wt.% of a bending fatigue-resistance modifier (Z). |
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Bibliography: | Application Number: JP19980197134 |