ADHESIVES FOR CHEMICAL MECHANICAL PLANARIZATION APPLICATIONS
Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
06.06.2019
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use. |
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| AbstractList | Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use. |
| Author | BOGNER, Josh M HSEIH, Dong-Tsai |
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| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | 用於化學機械平坦化應用的粘合劑 |
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| Notes | Application Number: HK20180112442 |
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| PublicationYear | 2019 |
| RelatedCompanies | Avery Dennison Corporation |
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| Snippet | Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and... |
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| SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| Title | ADHESIVES FOR CHEMICAL MECHANICAL PLANARIZATION APPLICATIONS |
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