BONDING OF HEAT-ACTIVATED FILMS INCLUDING A PLASTICIZER

Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plastici...

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Bibliographic Details
Main Authors COVELLI, CARMEN, A, FARMER, DOUGLAS, K, MASTERS, GAVIN, N
Format Patent
LanguageChinese
English
Published 23.03.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.
Bibliography:Application Number: HK20110107508