A diamond assembly

• Main Authors: Julian James Sargood Ellis, Hossein Zarrin, Timothy Peter Mollart, Daniel James Twitchen
• Format: Patent
• Language: English
• Published: 13.07.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOUNDS THEREOF; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INORGANIC CHEMISTRY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; NON-METALLIC ELEMENTS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

A bonded diamond assembly comprises: a polycrystalline diamond wafer 1 having a largest linear dimension of between 25 mm and 200 mm, a substrate 2 and a bonding layer 3 located between the diamond 1 and the substrate 2 and bonding them together. The bonding layer 3, when inspected using ultrasound using a resolution of 50 µm, a focal length selected to inspect the bonding layer, and frequencies of 100 MHz and 30 MHz, comprises low numbers of voids 9 extending either across the thickness of the bonding layer and low numbers of voids 10,11,12 that do not extend across the thickness of the bonding layer. Also disclosed is a method of forming the bonded diamond assembly, an electrochemical cell comprising the bonded diamond assembly and an apparatus suitable for forming the bonded diamond assembly. Further disclosed is a similar assembly where the surface of the polycrystalline diamond wafer 1 contacting the bonding layer 3 has an average flatness of no more than 40 µm.