First level package for pressure sensor module

A first level package system 117 for measuring pressure comprising a lead frame 103 and an overmold encapsulating at least a part of the lead frame to form a first cavity around the pressure sensor. The frame is coupled to a substrate 108, and consists of electrical components 102, which may include...

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Bibliographic Details
Main Authors Frank Morsink, Andrew C Herron
Format Patent
LanguageEnglish
Published 22.01.2020
Subjects
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
TESTING
TRANSPORTING
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Summary:A first level package system 117 for measuring pressure comprising a lead frame 103 and an overmold encapsulating at least a part of the lead frame to form a first cavity around the pressure sensor. The frame is coupled to a substrate 108, and consists of electrical components 102, which may include an application specific integrated circuit (ASIC). A pressure sensing element 116 mounted to the substrate communicates electrically with the frame. A central opening 107 may extend between a first and second side of the substrate (opposite the first side) where the pressure sensor covers the central opening to seal the first cavity from the second side of the substrate. There may be a housing forming a first pressure chamber about the first cavity. The housing may have at least one fluid inlet allowing a pressurised fluid to enter the first pressure chamber. The pressure sensor may be a MEMS based pressure sensing element detecting a pressure difference between the first and second side of the substrate. Also a method for fabricating a first level package system.
Bibliography:Application Number: GB20190006642