Electronic package for millimeter wave semiconductor dies

• Main Authors: KEISHI OKAMOTO, DANNY ELAD, KAZUSHIGE TORIYAMA, EVGENY SHUMAKER, NOAM KAMINSKI
• Format: Patent
• Language: English
• Published: 23.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular w...