Method and device for facilitating separation of sliced wafers

• Main Authors: ARIEL HILDESHEM, SVETLANA BRODETSKI, BOAZ NISHRI
• Format: Patent
• Language: English
• Published: 07.12.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

An apparatus for separating a front wafer from a stack 18 of wafers with internal gaps between the wafers 20 includes a chuck 10 for gripping the front wafer 20, coupled to a mechanical arm 26 and a drive 32 for moving the arm 26 to bring the chuck 10 to the front wafer 20 and to separate the wafer from the stack 18 of wafers. Further included is a heater 24 for heating the front wafer 20 so as to raise the temperature within the internal gap between the front wafer and the adjacent wafer of the stack 18 of wafers above the temperature of more distant internal gaps within the stack. The heater may comprise hot jets of steam directed onto the front wafer of the stack.