Laminated photosensitive dielectric for semiconductor device

• Main Author: DOMINGO A FIGUEREDO
• Format: Patent
• Language: English
• Published: 07.10.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A photosensitive dielectric 23, which may be laminated if large thickness required, is formed between the active components and the passive components and transmission lines of a semiconductor device. The photosensitive dielectric may be bonded to the substrate using a roll-on procedure including el...