STRUCTURE DE MONTAGE POUR UN CIRCUIT A SEMI-CONDUCTEUR

In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an e...

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Main Author MIYOSHI TADAYOSHI
Format Patent
LanguageFrench
Published 01.08.2003
Edition7
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Abstract In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
AbstractList In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
Author MIYOSHI TADAYOSHI
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Snippet In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Title STRUCTURE DE MONTAGE POUR UN CIRCUIT A SEMI-CONDUCTEUR
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