Support structure for large scale integrated circuit mounted in stack formation
The box support structure for an integrated circuit comprises band supports (1a-1e) and pegs (22) mounted vertically on a cabling panel (2). The LSI components (12) are mounted on the respective support bands (1a-1e), which each comprise base layers (13), with external connections provided on these...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English French |
Published |
18.07.1997
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The box support structure for an integrated circuit comprises band supports (1a-1e) and pegs (22) mounted vertically on a cabling panel (2). The LSI components (12) are mounted on the respective support bands (1a-1e), which each comprise base layers (13), with external connections provided on these base layers in a network configuration. The external connections (11) comprise a hole (18) and a conducting design formed on the inner surface of the hole. The vertical pegs are introduced into the holes in the panels, with the connections made via the conductor-lined holes.
La présente invention concerne une structure de boîtier pour un circuit intégré qui comprend des supports de bandes (la à le), et un ergot (22) monté de façon verticale sur un panneau de câblage (2). Des LSI (12) sont montés sur les supports de bandes (1a à 1e) respectivement. Les supports de bandes (1a à 1e) comprennent respectivement des couches de base (13). Des bornes de connexion extérieures (11) sont prévues sur la couche de base (13) en réseau. La borne de connexion extérieure (11) comprend un trou traversant (18) et un motif conducteur (17) prévu sur la surface interne du trou traversant (18). Les ergots (22) montés de façon verticale sur le panneau de câblage (2) sont introduits dans les bornes de connexion extérieures (11) des supports de bandes (1a à 1e). Les bornes de connexion extérieures (11a à 11e) sont reliées électriquement par les ergots (22). |
---|---|
AbstractList | The box support structure for an integrated circuit comprises band supports (1a-1e) and pegs (22) mounted vertically on a cabling panel (2). The LSI components (12) are mounted on the respective support bands (1a-1e), which each comprise base layers (13), with external connections provided on these base layers in a network configuration. The external connections (11) comprise a hole (18) and a conducting design formed on the inner surface of the hole. The vertical pegs are introduced into the holes in the panels, with the connections made via the conductor-lined holes.
La présente invention concerne une structure de boîtier pour un circuit intégré qui comprend des supports de bandes (la à le), et un ergot (22) monté de façon verticale sur un panneau de câblage (2). Des LSI (12) sont montés sur les supports de bandes (1a à 1e) respectivement. Les supports de bandes (1a à 1e) comprennent respectivement des couches de base (13). Des bornes de connexion extérieures (11) sont prévues sur la couche de base (13) en réseau. La borne de connexion extérieure (11) comprend un trou traversant (18) et un motif conducteur (17) prévu sur la surface interne du trou traversant (18). Les ergots (22) montés de façon verticale sur le panneau de câblage (2) sont introduits dans les bornes de connexion extérieures (11) des supports de bandes (1a à 1e). Les bornes de connexion extérieures (11a à 11e) sont reliées électriquement par les ergots (22). |
Author | MIYOSHI TADAYOSHI |
Author_xml | – fullname: MIYOSHI TADAYOSHI |
BookMark | eNqNizsKAjEQQFNo4e8OcwELXYm1iIudoPbLMM4uwewkTCb31wUPYPV48N7SzSQJL9ztUXNOalBMK1lVhj4pRNSBoRBGhiDGg6LxCygo1WAwpiqTB_l-SO_pGdFCkrWb9xgLb35cOWgvz_N1yzl1XDISC1vX3vfHQ-O9P-2aP5IPcEg5AA |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | STRUCTURE DE BOITIER POUR CIRCUIT INTEGRE |
Edition | 6 |
ExternalDocumentID | FR2743666A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_FR2743666A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 11:22:20 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_FR2743666A13 |
Notes | Application Number: FR19970000405 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970718&DB=EPODOC&CC=FR&NR=2743666A1 |
ParticipantIDs | epo_espacenet_FR2743666A1 |
PublicationCentury | 1900 |
PublicationDate | 19970718 |
PublicationDateYYYYMMDD | 1997-07-18 |
PublicationDate_xml | – month: 07 year: 1997 text: 19970718 day: 18 |
PublicationDecade | 1990 |
PublicationYear | 1997 |
RelatedCompanies | NEC CORPORATION |
RelatedCompanies_xml | – name: NEC CORPORATION |
Score | 2.4769952 |
Snippet | The box support structure for an integrated circuit comprises band supports (1a-1e) and pegs (22) mounted vertically on a cabling panel (2). The LSI components... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | Support structure for large scale integrated circuit mounted in stack formation |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970718&DB=EPODOC&locale=&CC=FR&NR=2743666A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD6MKbo3nYqbF_IgfSvSNbH1oYjrhSFsHWXK3saSplDUbqwd_n1Psq76om9JStLmwOn5cvm-A3AnXWGlGFpNhvDTpIy56HPUMoUl9ckgQm5FTh5PHkav9GXO5i3I91wYrRP6pcUR0aME-nul_9frn02sQN-tLO95jk2rp2jmBUZa08UcjJiuEQy9cBoHsW_4vhclxiTx8L02IvVnXCgdKBStZPbDt6Eipax_R5ToBA6nOFhRnUJLFl049veJ17pwNK7Pu7FYu155BrHKv4lYmewUX7cbSRBvkg91k5uUaGlJGumHlIh8I7Z5RT5VKgis5wX2W4p30pAVz4FE4cwfmfhli8YKiyhp5mBfQLtYFfISCBNy4HLBrCxd0kfqcFwBMUoHGVeajJndg96fw_T_eXYFnZ1Qq2Na7jW0cWryBsNvxW-14b4BkP2Kjw |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3PT4MwFH5ZpnHedGqcP3sw3IhhtIIHYhyMoI5tIWh2I6OUhKhsGSz--z46hl70BjSU9iWP97223_cAboTJtQRDq8oQfqqUMRN9jmoq14TcGUTIXZGT_fGd90qfZ2zWgmzLhZE6oV9SHBE9iqO_l_J_vfxZxHLk2criNs7w0eLBDS1HSWq6mIER01ScgTWcTpyJrdi25QbKOLDwuzoi9UdMlHYMzAhlpvQ2qEgpy98RxT2A3Sl2lpeH0BJ5Fzr2tvBaF_b8er8bL2vXK45gUtXfRKxMNoqv65UgiDfJR3WSmxRoaUEa6YeE8GzF11lJPqtSEHif5fjenL-Thqx4DMQdhran4siixgqRGzRz0E-gnS9ycQqEcdE3Y860NJnTe2rEmAExSvtpXGkypnoPen92c_ZP2zV0vNAfRaOn8cs57G9EWw1VMy-gjdMUlxiKy_hKGvEbL76NeQ |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Support+structure+for+large+scale+integrated+circuit+mounted+in+stack+formation&rft.inventor=MIYOSHI+TADAYOSHI&rft.date=1997-07-18&rft.externalDBID=A1&rft.externalDocID=FR2743666A1 |