METHOD FOR PRODUCING A SOLDERED CONNECTION BETWEEN A CARRIER ELEMENT AND AT LEAST ONE ELECTRONIC STRUCTURAL ELEMENT, COMPOSITE COMPONENT AND MACHINE FOR PRODUCING A COMPOSITE COMPONENT

• Main Authors: FISCHER, Arne Stephen, ZILLMANN, Benjamin, FISCHER, Alexander, ECKOLD, Pierre
• Format: Patent
• Language: English; French; German
• Published: 30.10.2024
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to a method for producing a soldered connection between a carrier element (32) and at least one electronic structural element (36) by means of a solder, wherein the solder is printed on the carrier element (32) and/or the electronic structural element (36) by means of an additive manufacturing process. The invention also relates to a composite component (30) comprising a carrier element (32) and at least one electronic structural element (36), wherein the carrier element (32) and the electronic structural element (36) are connected by means of a solder layer (34), wherein the solder layer (34) is a solder layer (34) additively manufactured on the carrier element (32) and/or on the electronic structural element (36). The invention additionally relates to a machine for producing a composite component (30) composed of a carrier element (32) with at least one electronic structural element (36) by way of a solder layer (34), wherein the machine is designed to print the solder layer (34) onto the carrier element (32) and/or the electronic structural element (36) by means of an additive manufacturing process.