MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES
A method of processing a semiconductor wafer includes: forming one or more epitaxial layers over a first main surface of the semiconductor wafer; forming one or more porous layers in the semiconductor wafer or in the one or more epitaxial layers, wherein the semiconductor wafer, the one or more epit...
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| Main Authors | , , , , , , , |
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| Format | Patent |
| Language | English French German |
| Published |
28.08.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method of processing a semiconductor wafer includes: forming one or more epitaxial layers over a first main surface of the semiconductor wafer; forming one or more porous layers in the semiconductor wafer or in the one or more epitaxial layers, wherein the semiconductor wafer, the one or more epitaxial layers and the one or more porous layers collectively form a substrate; forming doped regions of a semiconductor device in the one or more epitaxial layers; and after forming the doped regions of the semiconductor device, separating a non-porous part of the semiconductor wafer from a remainder of the substrate along the one or more porous layers. |
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| AbstractList | A method of processing a semiconductor wafer includes: forming one or more epitaxial layers over a first main surface of the semiconductor wafer; forming one or more porous layers in the semiconductor wafer or in the one or more epitaxial layers, wherein the semiconductor wafer, the one or more epitaxial layers and the one or more porous layers collectively form a substrate; forming doped regions of a semiconductor device in the one or more epitaxial layers; and after forming the doped regions of the semiconductor device, separating a non-porous part of the semiconductor wafer from a remainder of the substrate along the one or more porous layers. |
| Author | BINTER, Alexander Christian SANTOS RODRIGUEZ, Francisco, Javier GOLLER, Bernhard SCHULZE, Hans-Joachim MODER, Iris HOECHBAUER, Tobias, Franz Wolfgang PICCIN, Matteo HUBER, Martin |
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| DocumentTitleAlternate | FABRICATION ET RÉUTILISATION DE SUBSTRATS À SEMI-CONDUCTEURS HERSTELLUNG UND WIEDERVERWENDUNG VON HALBLEITERSUBSTRATEN |
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| RelatedCompanies | Infineon Technologies AG |
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| Snippet | A method of processing a semiconductor wafer includes: forming one or more epitaxial layers over a first main surface of the semiconductor wafer; forming one... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES |
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