SPUTTERING TARGET

• Main Authors: LINKE, Christian, CHEN, Chao, KUNIYA, Tsutomu, LU, Jiandong, SCHMIDT, Hennrik
• Format: Patent
• Language: English; French; German
• Published: 24.07.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides a sputtering target, including a tubular backing tube, of which an axis being defined as an axial direction, and a plane in which a radial direction lies being perpendicular to the axial direction; at least one cylindrical target segment arranged on a tubular backing tube extending along the axial direction through at least 90% of a total length of the at least one cylindrical target segment; a bonding material arranged between the tubular backing tube and the cylindrical target segment, the sputtering target further including a stop member for a target segment adjacent to the stop member, the stop member being monolithically formed with and radially protruding along the tubular backing tube at an axial end region of the tubular backing tube and extending along a part of a circumference of the tubular backing tube, a circumferential sealing member inserted between the stop member and the adjacent target segment to prevent leakage of the bonding material.