ALUMINA PARTICLES AND RESIN COMPOSITION USING SAME
Provided is an alumina particle for use as a filler for resin compositions, which can improve the thermal conductivity of the resin composition over conventional resin compositions. It is an alumina particle having a particle diameter D50 of more than 100 µm at a cumulative value of 50% from the fin...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
10.04.2024
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Subjects | |
Online Access | Get full text |
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