ALUMINA PARTICLES AND RESIN COMPOSITION USING SAME

• Main Authors: DAIMON UEHARA, Michiru, SHIMAZAKI, Yasuharu, NAKATA, Kunihiko, EGAWA, Takamasa, ARISE, Ichiro
• Format: Patent
• Language: English; French; German
• Published: 10.04.2024
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS; INORGANIC CHEMISTRY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is an alumina particle for use as a filler for resin compositions, which can improve the thermal conductivity of the resin composition over conventional resin compositions. It is an alumina particle having a particle diameter D50 of more than 100 µm at a cumulative value of 50% from the fine particle side in the cumulative particle size distribution, and having an α-alumina rate of 90% or more; wherein the α-alumina is a monocrystalline alumina. The alumina particle preferably has a Na content of 800 ppm or less. In addition, the alumina particle preferably has a particle diameter D10 of 70 to 135 µm at a cumulative value of 10% from the fine particle side in the cumulative particle size distribution.