HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND METHOD FOR ASSEMBLING CIRCUIT MODULE

• Main Authors: MA, Weice, YING, Xiaoyuan, LIN, Benwei, CHEN, Wei
• Format: Patent
• Language: English; French; German
• Published: 27.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

This application relates to the field of communication technologies, and discloses a heat dissipation apparatus, a circuit module, an electronic device, and a circuit module assembly method. In the heat dissipation apparatus, a support is configured to be mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board, so that a heat conducting surface of the heat source can penetrate the assembly opening on a bearing board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. A peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. At least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source. The heat dissipation apparatus in this application can appropriately adjust the force-applying portion while the mounting portions keeps unchanged, to improve attachment tightness between the heat sink and the heat source, thereby improving heat dissipation effect of the heat sink on the heat source.