SYSTEMS AND METHODS FOR EVALUATING THE RELIABILITY OF SEMICONDUCTOR DIE PACKAGES
A system and method for evaluating the reliability of semiconductor die packages are configured to sort a plurality of semiconductor dies with a Known Good Die (KGD) subsystem based on a comparison of an inline part average testing (I-PAT) score of each of the plurality of semiconductor dies to a pl...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English French German |
Published |
29.11.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!