SYSTEMS AND METHODS FOR EVALUATING THE RELIABILITY OF SEMICONDUCTOR DIE PACKAGES
A system and method for evaluating the reliability of semiconductor die packages are configured to sort a plurality of semiconductor dies with a Known Good Die (KGD) subsystem based on a comparison of an inline part average testing (I-PAT) score of each of the plurality of semiconductor dies to a pl...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
29.11.2023
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Subjects | |
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Abstract | A system and method for evaluating the reliability of semiconductor die packages are configured to sort a plurality of semiconductor dies with a Known Good Die (KGD) subsystem based on a comparison of an inline part average testing (I-PAT) score of each of the plurality of semiconductor dies to a plurality of I-PAT score thresholds, where the semiconductor die data includes the I-PAT score for each of the plurality of semiconductor dies, where the I-PAT score represents a weighted defectivity of the corresponding semiconductor die. The semiconductor dies may be filtered to remove at-risk semiconductor dies prior to sorting. The semiconductor die data may be received from a plurality of semiconductor die supplier subsystems. The KGD subsystem may transmit semiconductor die reliability data about the sorted plurality of semiconductor dies to a plurality of semiconductor die packager subsystems. |
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AbstractList | A system and method for evaluating the reliability of semiconductor die packages are configured to sort a plurality of semiconductor dies with a Known Good Die (KGD) subsystem based on a comparison of an inline part average testing (I-PAT) score of each of the plurality of semiconductor dies to a plurality of I-PAT score thresholds, where the semiconductor die data includes the I-PAT score for each of the plurality of semiconductor dies, where the I-PAT score represents a weighted defectivity of the corresponding semiconductor die. The semiconductor dies may be filtered to remove at-risk semiconductor dies prior to sorting. The semiconductor die data may be received from a plurality of semiconductor die supplier subsystems. The KGD subsystem may transmit semiconductor die reliability data about the sorted plurality of semiconductor dies to a plurality of semiconductor die packager subsystems. |
Author | RATHERT, Robert J PRICE, David W LENOX, Chet V DONZELLA, Oreste |
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DocumentTitleAlternate | SYSTÈMES ET PROCÉDÉS D'ÉVALUATION DE LA FIABILITÉ DE BOÎTIERS DE PUCES SEMI-CONDUCTRICES SYSTEME UND VERFAHREN ZUR BEWERTUNG DER ZUVERLÄSSIGKEIT VON HALBLEITERCHIPGEHÄUSEN |
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Snippet | A system and method for evaluating the reliability of semiconductor die packages are configured to sort a plurality of semiconductor dies with a Known Good Die... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | SYSTEMS AND METHODS FOR EVALUATING THE RELIABILITY OF SEMICONDUCTOR DIE PACKAGES |
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