METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS

Through-holes of a substrate are initially plated with copper to form an incomplete bridge in the middle of the through-holes by a phase shift pulse plating process on both sides of the substrate simultaneously. This is followed by pulse plating the entire substrate to complete the filling of the th...

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Bibliographic Details
Main Authors JOHN, Jimmy, JAYARAJU, Nagarajan, DZIEWISZEK, Joanna J, THORESEN, Derek J, NIAZIMBETOVA, Zuhra I
Format Patent
LanguageEnglish
French
German
Published 06.09.2023
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Through-holes of a substrate are initially plated with copper to form an incomplete bridge in the middle of the through-holes by a phase shift pulse plating process on both sides of the substrate simultaneously. This is followed by pulse plating the entire substrate to complete the filling of the through-holes.
Bibliography:Application Number: EP20230158576