MULTILAYER ELECTRONIC COMPONENT
A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English French German |
Published |
26.07.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni-Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer. |
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Bibliography: | Application Number: EP20220215000 |