ELECTROPLATING CONTROLLER WITH POWER BASED HEAD-ROOM CONTROL

• Main Author: BORJESSON, Mikael R
• Format: Patent
• Language: English; French; German
• Published: 19.07.2023
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; APPARATUS THEREFOR; CHEMISTRY; CONTROL OR REGULATION THEREOF; CONTROLLING; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; GENERATION; METALLURGY; PHYSICS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; REGULATING; SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES

A method of controlling a headroom voltage of a transistor stage of an electroplating system to maintain a target power dissipation across the transistor stage may include maintaining a headroom voltage in the transistor stage for a load in the electroplating system. The method may also include measuring an instantaneous power dissipation in the transistor stage and generating a difference output representing a difference between the instantaneous power dissipation in the transistor stage and the target power dissipation in the transistor stage. A voltage across the transistor stage and the load may then be adjusted using the difference output such that the headroom voltage in the transistor stage is adjusted to maintain the target power dissipation in the transistor stage.