METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE

A method for manufacturing an optoelectronic device includes providing a support supporting a plurality of three-dimensional semiconductor structures, forming a sacrificial portion under a first set of 3D structures of the plurality of three-dimensional semiconductor structures, forming a barrier po...

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Main Authors GIBERT, Philippe, REBAUD, Mickaël, POURQUIER, Eric, HUGON, Xavier, LACAVE, Thomas, MAYER, Frédéric, PETITPREZ, Emmanuel
Format Patent
LanguageEnglish
French
German
Published 23.10.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A method for manufacturing an optoelectronic device includes providing a support supporting a plurality of three-dimensional semiconductor structures, forming a sacrificial portion under a first set of 3D structures of the plurality of three-dimensional semiconductor structures, forming a barrier portion around the sacrificial portion, said barrier portion having a basal wall extending under the sacrificial portion, and a lateral wall extending at the edge of the sacrificial portion, forming an access trench up to the sacrificial portion, the access trench extending continuously along the lateral wall of the barrier portion, etching the sacrificial portion from the access trench, and removing the first set of 3D structures.
AbstractList A method for manufacturing an optoelectronic device includes providing a support supporting a plurality of three-dimensional semiconductor structures, forming a sacrificial portion under a first set of 3D structures of the plurality of three-dimensional semiconductor structures, forming a barrier portion around the sacrificial portion, said barrier portion having a basal wall extending under the sacrificial portion, and a lateral wall extending at the edge of the sacrificial portion, forming an access trench up to the sacrificial portion, the access trench extending continuously along the lateral wall of the barrier portion, etching the sacrificial portion from the access trench, and removing the first set of 3D structures.
Author LACAVE, Thomas
POURQUIER, Eric
REBAUD, Mickaël
MAYER, Frédéric
GIBERT, Philippe
PETITPREZ, Emmanuel
HUGON, Xavier
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– fullname: LACAVE, Thomas
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– fullname: PETITPREZ, Emmanuel
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DocumentTitleAlternate PROCÉDÉ DE FABRICATION D'UN DISPOSITIF OPTOÉLECTRONIQUE
VERFAHREN ZUR HERSTELLUNG EINER OPTOELEKTRONISCHEN VORRICHTUNG
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Snippet A method for manufacturing an optoelectronic device includes providing a support supporting a plurality of three-dimensional semiconductor structures, forming...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE
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