CMP COMPOSITION FOR POLISHING HARD MATERIALS

A slurry for chemical mechanical polishing (CMP) includes an aqueous liquid carrier, an oxygen and anion containing transition metal compound or polyatomic cations including a transition metal and oxygen or hydrogen, and a per-based oxidizer. The anion for the oxygen and anion containing transition...

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Main Authors SINGH, Rajiv K, SINGH, Deepika, DE, Sunny, GINDE, Chaitanya Dnyanesh, VERMA, Aditya Dilip
Format Patent
LanguageEnglish
French
German
Published 07.12.2022
Subjects
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SKI WAXES
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Abstract A slurry for chemical mechanical polishing (CMP) includes an aqueous liquid carrier, an oxygen and anion containing transition metal compound or polyatomic cations including a transition metal and oxygen or hydrogen, and a per-based oxidizer. The anion for the oxygen and anion containing transition metal compound can include oxynitrate, oxychloride, oxyhydroxide, oxyacetate, oxysulfide, or oxysulfate. The per-based oxidizer can be a permanganate compound.
AbstractList A slurry for chemical mechanical polishing (CMP) includes an aqueous liquid carrier, an oxygen and anion containing transition metal compound or polyatomic cations including a transition metal and oxygen or hydrogen, and a per-based oxidizer. The anion for the oxygen and anion containing transition metal compound can include oxynitrate, oxychloride, oxyhydroxide, oxyacetate, oxysulfide, or oxysulfate. The per-based oxidizer can be a permanganate compound.
Author DE, Sunny
SINGH, Rajiv K
GINDE, Chaitanya Dnyanesh
VERMA, Aditya Dilip
SINGH, Deepika
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DocumentTitleAlternate CMP-ZUSAMMENSETZUNG ZUM POLIEREN VON HARTEN MATERIALIEN
COMPOSITION DE CMP PERMETTANT LE POLISSAGE DE MATÉRIAUX DURS
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RelatedCompanies University of Florida Research Foundation, Inc
Entegris, Inc
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Snippet A slurry for chemical mechanical polishing (CMP) includes an aqueous liquid carrier, an oxygen and anion containing transition metal compound or polyatomic...
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SubjectTerms ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SKI WAXES
Title CMP COMPOSITION FOR POLISHING HARD MATERIALS
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