FILM-FORMING METHOD AND FILM-FORMING APPARATUS

• Main Authors: MUROTANI, Hiroshi, OHTAKI, Yoshiyuki, MIYAUCHI, Mitsuhiro, HASEGAWA, Tomokazu, MATSUDAIRA, Takayuki
• Format: Patent
• Language: English; French; German
• Published: 14.02.2024
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The disclosure includes: installing at least a vapor deposition material and substrates (S) inside a film-forming chamber (2a); setting a first region (A) including the substrates (S) inside the film-forming chamber (2a) to an atmosphere of 0.05 to 100 Pa by evacuation and/or supply of a gas that does not change a composition of the vapor deposition material; setting a second region (B) including the vapor deposition material inside the film-forming chamber (2a) to 0.05 Pa or less; and in this state, vaporizing the vapor deposition material in the second region (B) by a vacuum vapor deposition method to form films of the vaporized vapor deposition material on the vapor deposition objects in the first region (A).