INTRA-MODULE SERIAL COMMUNICATION INTERFACE FOR RADIO FREQUENCY DEVICES
Systems, methods, and apparatus for improving bus latency and reducing bus congestion are described. A data communication apparatus has a first interface circuit configured to couple the data communication apparatus to a primary serial bus, a second interface circuit configured to couple the data co...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
20.07.2022
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Subjects | |
Online Access | Get full text |
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