METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MICROSTRUCTURES

• Main Authors: OZAI, Toshiyuki, KONDO, Kazunori, OHORI, Keiji, UEDA, Shuhei, KITAGAWA, Taichi, KAWAHARA, Minoru, OGAWA, Yoshinori, MATSUMOTO, Nobuaki, OTAKE, Kohei
• Format: Patent
• Language: English; French; German
• Published: 06.07.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

A method for transferring microstructures, comprising at least the steps of:(i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate;(ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the plurality of microstructures temporality fixed thereon;(iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon;(iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and(v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.