DISPLAY DEVICE USING MICRO LED AND MANUFACTURING METHOD THEREFOR

Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semico...

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Main Authors CHANG, Wonjae, YANG, Hyeyoung, KO, Jisoo, CHO, Hyunwoo
Format Patent
LanguageEnglish
French
German
Published 29.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.
AbstractList Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.
Author YANG, Hyeyoung
KO, Jisoo
CHO, Hyunwoo
CHANG, Wonjae
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DocumentTitleAlternate ANZEIGEVORRICHTUNG MIT MIKRO-LED UND HERSTELLUNGSVERFAHREN DAFÜR
DISPOSITIF D'AFFICHAGE UTILISANT UNE MICRO-DEL ET SON PROCÉDÉ DE FABRICATION
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title DISPLAY DEVICE USING MICRO LED AND MANUFACTURING METHOD THEREFOR
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