METHOD OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICES

• Main Author: CREMA, Paolo
• Format: Patent
• Language: English; French; German
• Published: 13.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In a method of manufacturing a multi-die semiconductor device (10), a metal leadframe is provided which includes a die pad (100) and electrically-conductive leads (102) arranged around the die pad. A first (12) and a second (14) semiconductor dice are arranged onto the die pad. A laser-activatable material is provided onto the dice (12, 14) and the leads (102), and a set of laser-activated lines is patterned which includes a first subset of lines coupling selected bonding pads of the dice (12, 14) to selected leads (102), a second subset of lines coupling selected bonding pads of the dice (12, 14) amongst themselves, and a third subset of lines coupling the lines in the second subset of lines to at least one line in the first subset of lines, and/or to at least one electrically-conductive lead. A first metallic layer is deposited onto the laser-activated lines to provide respective first, second and third subsets of electrically-conductive lines. A second metallic layer is selectively deposited onto the first and second subsets of electrically-conductive lines by means of electroplating to provide respective first (16C', 16C) and second (16B', 16B) subsets of electrically-conductive tracks. The electrically-conductive lines in said third subset of electrically-conductive lines are selectively removed.