SOLDER-ATTACHED PRODUCT MANUFACTURING DEVICE, AND SOLDER-ATTACHED PRODUCT MANUFACTURING METHOD

• Main Authors: MARUYAMA, Megu, NAGAHAMA, Masanobu, MATSUDA, Jun, OZAWA, Naoto, SUZUKI, Takayuki
• Format: Patent
• Language: English; French; German
• Published: 01.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A solder-attached product manufacturing device 1 is provided with: a stage 13 on which a substrate W having an array of solder is placed; a cover 16 which covers at least an upper portion of the substrate W placed on the stage 13 with a predetermined distance therebetween; a chamber 11 in which the stage 13 and the cover 16 are accommodated; a heating unit 15 which heats the substrate W on the stage 13; and a reducing gas supply device 19 which supplies a reducing gas F. A solder-attached product manufacturing method comprises: placing a substrate W on a stage 13 using the solder-attached product manufacturing device 1; covering the substrate W placed on the stage 13 with a cover 16; heating the substrate W; and supplying a reducing gas F into a chamber 11.