ACTIVE-BY-ACTIVE PROGRAMMABLE DEVICE

• Main Authors: DELLINGER, Eric F, BOLSENS, Ivo, MAIDEE, Pongstorn, KAVIANI, Alireza S
• Format: Patent
• Language: English; French; German
• Published: 23.06.2021
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; PULSE TECHNIQUE

An example integrated circuit (IC) system includes a package substrate (202) having a programmable integrated circuit (IC) (101 A) and a companion IC (103A) mounted thereon, the programmable IC including a programmable fabric (404) and the companion IC including application circuitry (107A). The IC system further includes a system-in-package (SiP) bridge (144) including a first SiP IO circuit (140A) disposed in the programmable IC, a second SiP IO circuit (142) disposed in the companion IC, and conductive interconnect (138) on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits (110, 112) in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits (126, 128) in the companion IC coupled between the application circuitry and the second SiP IO circuit.