FUSING ELECTRONIC COMPONENTS INTO THREE-DIMENSIONAL OBJECTS

In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the f...

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Bibliographic Details
Main Authors CHAFFINS, Sterling, ERICKSON, Kris J, GEORGE, David, ZHAO, Lihua
Format Patent
LanguageEnglish
French
German
Published 20.01.2021
Subjects
ADDITIVE MANUFACTURING TECHNOLOGY
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
NANOTECHNOLOGY
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.
Bibliography:Application Number: EP20180910034