COOLING DEVICE

To provide a cooling device that can improve the reliability of joining between a base block and a heat pipe, while reducing the environmental impacts, and can also achieve both high contact thermal conductance and high resistance to vibration.A cooling device (1) includes a base block (10) includin...

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Bibliographic Details
Main Authors KATAYAMA Takahiro, SASAKI Chiyoshi, ISEMURA Masakazu
Format Patent
LanguageEnglish
French
German
Published 04.11.2020
Subjects
Online AccessGet full text

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Summary:To provide a cooling device that can improve the reliability of joining between a base block and a heat pipe, while reducing the environmental impacts, and can also achieve both high contact thermal conductance and high resistance to vibration.A cooling device (1) includes a base block (10) including a back-side portion (10a) thermally connected to electrical components (300) that are heating elements, a heat pipe group (20) formed of a plurality of heat pipes (21), each of which includes a first tubular portion (21a) and a second tubular portion (21b), the first tubular portion (21a) being fixed to a front-side portion (10b) of the base block (10) and being disposed along a planar direction of the base block (10), the second tubular portion (21b) being connected to the first tubular portion (21a) and being provided in a standing manner from the base block (10), and a fin group (30) formed of a plurality of fins (31), (31), ... fixed to the heat pipe group (20), the fins (31), (31), ... being parallel to each other in a standing direction of the heat pipe group (20).
Bibliography:Application Number: EP20180896705