RESIN COMPOSITION, PREPREG, RESIN-INCLUDING FILM, RESIN-INCLUDING METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

• Main Authors: FUJISAWA, Hiroyuki, YAMAUCHI, Akihiro, NAKAMURA, Yoshihiko, TUMURAYA, Yuuji, SHINPO, Takashi, TOSHIMITSU, Kenichi
• Format: Patent
• Language: English; French; German
• Published: 08.03.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

A resin composition is used which contains a maleimide compound represented by the following Formula (1), a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound.In Formula (1), s represents 1 to 5 and RA, RB, RC, and RDeach independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group.