A HEATSINK AND A METHOD OF MANUFACTURING A HEAT SINK

1. A heatsink comprising a heatsink base and cooling fins, wherein the heatsink base comprises a first surface which is adapted to be attached to a surface of a heat source and the cooling fins are attached to the heatsink base and arranged to extend from the heatsink base. The heatsink base compris...

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Bibliographic Details
Main Authors Manninen, Jorma, Silvennoinen, Mika, Pakarinen, Joni
Format Patent
LanguageEnglish
French
German
Published 19.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract 1. A heatsink comprising a heatsink base and cooling fins, wherein the heatsink base comprises a first surface which is adapted to be attached to a surface of a heat source and the cooling fins are attached to the heatsink base and arranged to extend from the heatsink base. The heatsink base comprises a second surface comprising grooves, the cooling fins comprise carbon-based material and a metallic base at one end of the fins, and the cooling fins are arranged to the grooves such that the metallic bases are in the grooves.
AbstractList 1. A heatsink comprising a heatsink base and cooling fins, wherein the heatsink base comprises a first surface which is adapted to be attached to a surface of a heat source and the cooling fins are attached to the heatsink base and arranged to extend from the heatsink base. The heatsink base comprises a second surface comprising grooves, the cooling fins comprise carbon-based material and a metallic base at one end of the fins, and the cooling fins are arranged to the grooves such that the metallic bases are in the grooves.
Author Manninen, Jorma
Pakarinen, Joni
Silvennoinen, Mika
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DocumentTitleAlternate DISSIPATEUR THERMIQUE ET PROCÉDÉ DE FABRICATION D'UN DISSIPATEUR THERMIQUE
KÜHLKÖRPER UND VERFAHREN ZUR HERSTELLUNG EINES KÜHLKÖRPERS
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Snippet 1. A heatsink comprising a heatsink base and cooling fins, wherein the heatsink base comprises a first surface which is adapted to be attached to a surface of...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title A HEATSINK AND A METHOD OF MANUFACTURING A HEAT SINK
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