BLOOD VESSEL MODEL

• Main Authors: KAKINUMA, Chihaya, SUNDBACK, Cathryn, A, ITO, Koju, HIKIMOTO, Daichi, MIMA, Shinji, SUEHIRO, Takafumi, NEVILLE, Craig, M
• Format: Patent
• Language: English; French; German
• Published: 29.07.2020
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; ADVERTISING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND,DEAF OR MUTE; BEER; BIOCHEMISTRY; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS THEREOF; CRYPTOGRAPHY; CULTURE MEDIA; DIAGRAMS; DISPLAY; EDUCATION; EDUCATIONAL OR DEMONSTRATION APPLIANCES; ENZYMOLOGY; GENERAL PROCESSES OF COMPOUNDING; GLOBES; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MEASURING; METALLURGY; MICROBIOLOGY; MICROORGANISMS OR ENZYMES; MUTATION OR GENETIC ENGINEERING; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PHYSICS; PLANETARIA; PROPAGATING, PRESERVING OR MAINTAINING MICROORGANISMS; SEALS; SPIRITS; TESTING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; VINEGAR; WINE; WORKING-UP

The present disclosure provides a blood vessel model including: a pair of channel members, mutually opposing each other, each of which includes an opposing face in which a respective microchannel is formed; and a porous membrane that includes plural through-holes penetrating in a thickness direction, that is disposed between the opposing faces of the pair of channel members, and that partitions between the microchannels, wherein the porous membrane is provided with a vascular endothelial cell layer so as to cover one face facing one of the microchannels, an average opening diameter of the through-holes is from 1 μιη to 20 μm, and an opening coverage ratio of the through-holes is from 30% to 70%.