DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECTS
A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further includes depositing a supercon...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
08.04.2020
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Subjects | |
Online Access | Get full text |
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Abstract | A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further includes depositing a superconducting metal in the interconnect opening, by performing a series of superconducting deposition and cooling processes to maintain a chamber temperature at or below a predetermined temperature until the superconducting metal has a desired thickness, to form a superconducting element in the superconductor interconnect structure. |
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AbstractList | A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further includes depositing a superconducting metal in the interconnect opening, by performing a series of superconducting deposition and cooling processes to maintain a chamber temperature at or below a predetermined temperature until the superconducting metal has a desired thickness, to form a superconducting element in the superconductor interconnect structure. |
Author | RENNIE, Michael KIRBY, Christopher F LUU, Vivien M MCLAUGHLIN, Sean R |
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DocumentTitleAlternate | MÉTHODOLOGIE DE DÉPÔT POUR INTERCONNEXIONS SUPRACONDUCTRICES ABSCHEIDUNGSVERFAHREN FÜR SUPRALEITENDE VERBINDUNGEN |
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Snippet | A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECTS |
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