POLISHING COMPOSITIONS AND METHODS OF USE THEREOF

The disclosure provides chemical mechanical polishing compositions and methods for polishing polysilicon films with high removal rates. The compositions include 1) an abrasive; 2) at least one compound of structure (I):3) at least one compound of structure (II):and 4) water; in which the composition...

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Bibliographic Details
Main Authors MISHRA, Abhudaya, LEONOV, Alexei P
Format Patent
LanguageEnglish
French
German
Published 05.02.2020
Subjects
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