POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
The disclosure provides chemical mechanical polishing compositions and methods for polishing polysilicon films with high removal rates. The compositions include 1) an abrasive; 2) at least one compound of structure (I):3) at least one compound of structure (II):and 4) water; in which the composition...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
05.02.2020
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Subjects | |
Online Access | Get full text |
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