OPTOELECTRONIC DEVICE
The present disclosure provides an electronic device providing a substrate, a first circuit (DC1), a plurality of bonding pads (BP) and a light emitting unit (LE). The first circuit (DC1) is disposed on the substrate. The bonding pads (BP) are disposed on the substrate, wherein at least one of the b...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English French German |
| Published |
11.05.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present disclosure provides an electronic device providing a substrate, a first circuit (DC1), a plurality of bonding pads (BP) and a light emitting unit (LE). The first circuit (DC1) is disposed on the substrate. The bonding pads (BP) are disposed on the substrate, wherein at least one of the bonding pads (BP) includes a bonding part (BR) and a connecting part (CTR), and the bonding part (BR) is electrically connected to the first circuit (DC1) through the connecting part (CTR). The light emitting unit (LE) is disposed on the substrate and corresponding to the bonding part (BR), and the light emitting unit (LE) is electrically connected to the first circuit (DC1) through at least one of the bonding pads (BP). At least a portion of the first circuit (DC1) is located between two of the bonding pads (BP) in a top view. |
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| AbstractList | The present disclosure provides an electronic device providing a substrate, a first circuit (DC1), a plurality of bonding pads (BP) and a light emitting unit (LE). The first circuit (DC1) is disposed on the substrate. The bonding pads (BP) are disposed on the substrate, wherein at least one of the bonding pads (BP) includes a bonding part (BR) and a connecting part (CTR), and the bonding part (BR) is electrically connected to the first circuit (DC1) through the connecting part (CTR). The light emitting unit (LE) is disposed on the substrate and corresponding to the bonding part (BR), and the light emitting unit (LE) is electrically connected to the first circuit (DC1) through at least one of the bonding pads (BP). At least a portion of the first circuit (DC1) is located between two of the bonding pads (BP) in a top view. |
| Author | Liao, Hung-Sheng Kao, Ker-Yih Lo, Min-Hsin Tseng, Ming-Chun |
| Author_xml | – fullname: Liao, Hung-Sheng – fullname: Tseng, Ming-Chun – fullname: Lo, Min-Hsin – fullname: Kao, Ker-Yih |
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| DocumentTitleAlternate | OPTOELEKTRONISCHE VORRICHTUNG DISPOSITIF OPTOÉLECTRONIQUE |
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| Notes | Application Number: EP20190171038 |
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| RelatedCompanies | InnoLux Corporation |
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| Snippet | The present disclosure provides an electronic device providing a substrate, a first circuit (DC1), a plurality of bonding pads (BP) and a light emitting unit... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | OPTOELECTRONIC DEVICE |
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