OPTOELECTRONIC DEVICE

The present disclosure provides an electronic device providing a substrate, a first circuit (DC1), a plurality of bonding pads (BP) and a light emitting unit (LE). The first circuit (DC1) is disposed on the substrate. The bonding pads (BP) are disposed on the substrate, wherein at least one of the b...

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Bibliographic Details
Main Authors Liao, Hung-Sheng, Tseng, Ming-Chun, Lo, Min-Hsin, Kao, Ker-Yih
Format Patent
LanguageEnglish
French
German
Published 11.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure provides an electronic device providing a substrate, a first circuit (DC1), a plurality of bonding pads (BP) and a light emitting unit (LE). The first circuit (DC1) is disposed on the substrate. The bonding pads (BP) are disposed on the substrate, wherein at least one of the bonding pads (BP) includes a bonding part (BR) and a connecting part (CTR), and the bonding part (BR) is electrically connected to the first circuit (DC1) through the connecting part (CTR). The light emitting unit (LE) is disposed on the substrate and corresponding to the bonding part (BR), and the light emitting unit (LE) is electrically connected to the first circuit (DC1) through at least one of the bonding pads (BP). At least a portion of the first circuit (DC1) is located between two of the bonding pads (BP) in a top view.
Bibliography:Application Number: EP20190171038