WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE

• Main Authors: LOFGREEN, Daniel, D, DRAKE, Paul, A, CAHILL, Andrew, GETTY, Jonathan
• Format: Patent
• Language: English; French; German
• Published: 17.07.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second...