WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
17.07.2019
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Subjects | |
Online Access | Get full text |
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Abstract | In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure. |
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AbstractList | In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure. |
Author | LOFGREEN, Daniel, D DRAKE, Paul, A GETTY, Jonathan CAHILL, Andrew |
Author_xml | – fullname: LOFGREEN, Daniel, D – fullname: DRAKE, Paul, A – fullname: CAHILL, Andrew – fullname: GETTY, Jonathan |
BookMark | eNrjYmDJy89L5WQwDXd0cw1SCA5xdPb29HNXCPFXcPMP8lVwVPAN9Qnx1AVL6zr5-7m4ugBVBYU6h4QGufIwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGNTQwMzYyNHQ2MilAAAkGEo4g |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | EMPILEMENT DE TRANCHES EN VUE DE FORMER UNE STRUCTURE LIÉE MULTI-TRANCHE WAFER-STAPELUNG ZUR BILDUNG EINER MEHRFACH-WAFERGEBUNDENEN STRUKTUR |
ExternalDocumentID | EP3510632A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_EP3510632A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 12:55:20 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English French German |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_EP3510632A13 |
Notes | Application Number: EP20170723839 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190717&DB=EPODOC&CC=EP&NR=3510632A1 |
ParticipantIDs | epo_espacenet_EP3510632A1 |
PublicationCentury | 2000 |
PublicationDate | 20190717 |
PublicationDateYYYYMMDD | 2019-07-17 |
PublicationDate_xml | – month: 07 year: 2019 text: 20190717 day: 17 |
PublicationDecade | 2010 |
PublicationYear | 2019 |
RelatedCompanies | Raytheon Company |
RelatedCompanies_xml | – name: Raytheon Company |
Score | 3.2097194 |
Snippet | In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190717&DB=EPODOC&locale=&CC=EP&NR=3510632A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8MwDLamgYAbDBAbD-WAeotYnyuHCrVpy0D0odLCblPXh7RLN7Ei_j5O1A0ucIviyEmsOM7nJDbAba7oaimXBZXvFybVSq2iuazkVNHN2pCrohzX3N8RhMY0055n-qwHy-1fGBEn9EsER0SNKlDfW7Ffr3-cWK54W7m5WyyxavXgp5YrdegYrRvCE8l1LC-O3IhJjGFJChNLxbVnqIqNQGmPn6J5mH3vzeGfUta_LYp_DPsxMmvaE-hVzQAO2Tbx2gAOgu6-G4ud6m1OQX-3fS8hr6nNEHE_kjQiCOACYpMge0mfqCBTJwpdz8VWScb4g4YzIL6XsinF_ue7uc69eDdS9Rz6zaqpLoBMcmNcGjLKThaZdXOtKngi7kldmGap5EMY_slm9A_tEo640KgIFHkF_fbjs7pGI9suboR4vgGt-Xud |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8MwDLamgRg3GCDGMwfUW8T6XDlMqEtbOuhjKi3sNvU1aZduYkX8fZxoG1zgFsWRk1hxnM9JbIC7TNHVUi4LKj_kJtVKraKZrGRU0c25IVdF2Z9zf0cQGl6qPU_1aQsW278wIk7olwiOiBpVoL43Yr9e_TixbPG2cn2fL7Bq-egmQ1vaoGO0bghPJHs0dCaRHTGJMSxJYTxUce0ZqmIhUNob8OC8_OT0NuKfUla_LYp7BPsTZFY3x9Cq6i502DbxWhcOgs19NxY3qrc-Af3dcp2YvCYWQ8T9RJKIIIALiEWC1E_GVJDpKAptx8ZWccr4g4ZTIK6TMI9i_7PdXGfOZDdS9Qza9bKuzoEMMqNfGjLKThaZdTOtKngi7sG8MM1SyXrQ-5PNxT-0W-h4SeDP_HH4cgmHXIBUBI28gnbz8Vldo8Ft8hshqm-dnX6K |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=WAFER+STACKING+TO+FORM+A+MULTI-WAFER-BONDED+STRUCTURE&rft.inventor=LOFGREEN%2C+Daniel%2C+D&rft.inventor=DRAKE%2C+Paul%2C+A&rft.inventor=CAHILL%2C+Andrew&rft.inventor=GETTY%2C+Jonathan&rft.date=2019-07-17&rft.externalDBID=A1&rft.externalDocID=EP3510632A1 |