WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
17.07.2019
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Subjects | |
Online Access | Get full text |
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Summary: | In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure. |
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Bibliography: | Application Number: EP20170723839 |